HS Code 8456.91 For dry-etching patterns on semiconductor materials

The HS Code 8456.91 is described as
For dry-etching patterns on semiconductor materials

Description

Machine-tools for WKNG any mat. by removal of mat., by electro-chemical/electron beam/ionic-beam/plasma arc processes, for dry-etching patterns on semiconductor mats.

(2019-08-02)

It belongs to the code group
HS Code 8456 (Machine-Tools For Working Any Material By Removal Of Material, By Laser Or Other Light Or Photon Bea)

To this Code "8456.91" belongs the sub codes
(No direct sub codes available)

The equivalent CPC Code (Rev. 1.1) is

44211:

Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultra-sonic, electro-discharge, electro-chemical, electron beam, ionic beam or plasma arc processes

The equivalent ISIC Code (Rev. 3.1) is

2922:	Manufacture of machine-tools
	Fabrication de machines-outils

The equivalent NAICS Code (Rev. 2002) is

332212:

Hand and Edge Tool Manufacturing

Translation of the Code description

8456.91:

For dry-etching patterns on semiconductor materials

(2019-08-02)

Alternative Spellings (synonyms): Material, Materialen, Materials

The Top500-Lexicon